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OSP 22F Fiberglass Small Batch Assembly Printed Circuit Assy
  • OSP 22F Fiberglass Small Batch Assembly Printed Circuit Assy

OSP 22F Fiberglass Small Batch Assembly Printed Circuit Assy

Place of Origin China
Brand Name HF
Certification ISO CE
Model Number Single Sided PCB Board
Product Details
Material:
22F
Layer Count:
1
Board Thickness:
1.0
Copper Thickness:
1oz
Solder Color:
Green
Silkscreen Colr:
White
Surface Finishing:
Osp
Service:
One Stop Turnkey Service
High Light: 

OSP small batch assembly

,

Fiberglass small batch assembly

,

Fiberglass printed circuit assy

Payment & Shipping Terms
Minimum Order Quantity
5PCS
Price
Negotiable
Packaging Details
box
Delivery Time
5~8 days
Payment Terms
L/C, T/T,PAYPAL
Product Description

 

Application
Products are applied to a wide range of High-tech industries such as: LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect. By unremitting work and effort to the marketing, products exports to American, Canada, Europe counties, Africa and other Asia-pacific countries

 

Capability

 
 High precision prototypePCB bulk production
Max Layers1-28 layers1-14 layers
MIN Line width(mil)3mil4mil
MIN Line space(mil)3mil4mil
Min via (mechanical drilling)Board thickness≤1.2mm0.15mm0.2mm
Board thickness≤2.5mm0.2mm0.3mm
Board thickness>2.5mmAspect Ration≤13:1Aspect Ration≤13:1
Aspect RationAspect Ration≤13:1Aspect Ration≤13:1
Board thicknessMAX8mm7mm
MIN2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm
MAX Board size610*1200mm610*1200mm
Max copper thickness0.5-6oz0.5-6oz
Immersion Gold/
Gold Plated Thickness
Immersion Gold:Au,1—8u”
Gold finger:Au,1—150u”
Gold Plated:Au,1—150u”
Nickel Plated :50—500u”
 
Hole copper thick25um 1mil25um 1mil
ToleranceBoard thicknessBoard thickness≤1.0mm:+/-0.1mm
1.0mm<Board thickness≤2.0mm:+/-10%
Board thickness>2.0mm:+/-8%
Board thickness≤1.0mm:+/-0.1mm
1.0mm<Board thickness≤2.0mm:+/-10%
Board thickness>2.0mm:+/-8%
Outline Tolerance≤100mm:+/-0.1mm
100< ≤300mm:+/-0.15mm
>300mm:+/-0.2mm
≤100mm:+/-0.13mm
100< ≤300mm:+/-0.15mm
>300mm:+/-0.2mm
Impedance±10%±10%
MIN Solder mask bridge 0.08mm 0.10mm
Plugging Vias capability 0.25mm--0.60mm 0.70mm--1.00mm

 

 

 
Advantages
1. PCB factory directly
2. Comprehensive quality control system
3. Competitive price
4. Quick turn delivery time from 48hours.
5. Certificates (ISO/UL E354810/RoHS)
6. 9 years experience in exporting service
7. No MOQ/MOV.
8. High quality. Strict through the AOI(Automated Optical Inspection), QA/QC, flying porbe ,Etesting, etc


 

OSP 22F Fiberglass Small Batch Assembly Printed Circuit Assy 0OSP 22F Fiberglass Small Batch Assembly Printed Circuit Assy 1OSP 22F Fiberglass Small Batch Assembly Printed Circuit Assy 2OSP 22F Fiberglass Small Batch Assembly Printed Circuit Assy 3OSP 22F Fiberglass Small Batch Assembly Printed Circuit Assy 4

CONTACT US AT ANY TIME

86-0755-23501556
West of 2nd Floor, Building 10, Zhengzhong Science Park, Xintian Community, Fuhai Street, Bao'an District, Shenzhen China 518103
Send your inquiry directly to us